US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,931, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Wen-Chieh Tsai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a semiconductor substrate. The semiconductor substrate includes a base portion, a semiconductor bar portion on a first active area of the base portion, a set of semiconductor branch portions extending from a sidewall of the semiconductor bar portion to a second active area of the base portion, and fi...