ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,715, issued on April 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).
"Isolation structure and memory device" was invented by Che-Jui Hsu (Taichung City, Taiwan), Ying-Fu Tung (Taichung City, Taiwan), Chun-Sheng Lu (Taichung City, Taiwan) and Mu-Lin Li (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An isolation structure, comprising: an isolation material layer, filled in a trench of a substrate; and a protection layer, having two portions extending from a topmost surface of the substrate to a top surface of the isolation material layer across boundaries of the trench, and covering opposite edges of the ...