US Patent Issued to Western Digital Technologies on July 14 for "Buffer layers, interlayers, and barrier layers comprising Heusler alloys for SOT based sensor, memory, and storage devices" (American, Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,028, issued on July 14, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Buffer layers, interlayers, and barrier layers comprising Heusler alloys for SOT based sensor, memory, and storage devices" was invented by Quang Le (San Jose, Calif.), Brian R. York (San Jose, Calif.), Cherngye Hwang (San Jose, Calif.), Xiaoyong Liu (San Jose, Calif.), Susumu Okamura (San Jose, Calif.), Michael A. Gribelyuk (San Jose, Calif.), Xiaoyu Xu (San Jose, Calif.), Randy G. Simmons (San Jose, Calif.), Kuok San Ho (Emerald Hills, Calif.) and Hisashi Takano (Fujisawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure genera...