US Patent Issued to Volantis Semiconductor on Nov. 3 for "Back side power delivery for wafer-scale integration with an isometric grid compression plate" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,813, issued on Nov. 3, was assigned to Volantis Semiconductor Inc. (Portland, Ore.).

"Back side power delivery for wafer-scale integration with an isometric grid compression plate" was invented by Kevin Nan Lam (Pleasanton, Calif.) and Tapabrata Ghosh (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed techniques enable back side power delivery for wafer-scale integration with an isometric grid compression plate. A wafer-scale integration interposer (WSII) is accessed. A front side of the WSII is bonded to functional chips. The WSII includes through-silicon vias (TSVs). Modular power substrates (MPSs) are attached to a back side o...