US Patent Issued to Vicor on March 31 for "Panel-molded electronic assemblies" (Massachusetts, California, New Hampshire Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,411, issued on March 31, was assigned to Vicor Corp. (Andover, Mass.).

"Panel-molded electronic assemblies" was invented by Patrizio Vinciarelli (Boston), Michael B. LaFleur (East Hampstead, N.H.), Sean Timothy Fleming (Worcester, Mass.), Rudolph F. Mutter (North Andover, Mass.) and Andrew T. D'Amico (Beverly Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the f...