US Patent Issued to Vicor on April 21 for "Panel-molded electronic assemblies" (Massachusetts, California, New Hampshire Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,471, issued on April 21, was assigned to Vicor Corp. (Andover, Mass.).

"Panel-molded electronic assemblies" was invented by Patrizio Vinciarelli (Boston), Michael B. LaFleur (East Hampstead, N.H.), Sean Timothy Fleming (Worcester, Mass.), Rudolph F. Mutter (North Andover, Mass.) and Andrew T. D' Amico (Beverly Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part...