US Patent Issued to Versum Materials US on March 17 for "Post chemical mechanical planarization (CMP) cleaning" (Arizona Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,499, issued on March 17, was assigned to Versum Materials US LLC (Tempe, Ariz.).

"Post chemical mechanical planarization (CMP) cleaning" was invented by Dnyanesh C. Tamboli (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic ...