US Patent Issued to Versum Materials US on Feb. 24 for "Post chemical mechanical planarization (CMP) cleaner comprising an organic acid/anionic surfactant mixture" (South Korean, American Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,699, issued on Feb. 24, was assigned to Versum Materials US LLC (Tempe, Ariz.).

"Post chemical mechanical planarization (CMP) cleaner comprising an organic acid/anionic surfactant mixture" was invented by Dnyanesh Tamboli (Gilbert, Ariz.), Hee Min Hwang (Suwon-si, South Korea) and Jeong Yun Yu (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a cleaning composition comprises water; one or more organic acid; at least two surfactants wherein the first type surfactant is a diphenyl disulfonic surfactant, the second type surfactant has a surface tension of less than 50 dynes/cm at 0.01 wt % concentra...