US Patent Issued to UTAC HEADQUARTERS on Sept. 1 for "Plasma diced wafers and methods thereof" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,418, issued on Sept. 1, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore).

"Plasma diced wafers and methods thereof" was invented by Dzafir Bin Mohd Shariff (Singapore), Enrique E. Sarile Jr. (Singapore), Jackson Fernandez Rosario (Singapore), Ronnie M. De Villa (Singapore) and Chan Loong Neo (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Reliable plasma dicing of wafers to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer. The patterned passivation stack serves as a plasma dicing mask for plasma dicing the wafer. The sidewalls of the mask o...