US Patent Issued to USI Science and Technology (Shenzhen) on June 9 for "Electronic package module and method for fabrication of the same" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,760, issued on June 9, was assigned to USI Science and Technology (Shenzhen) Co. Ltd. (Guangdong Province, China).

"Electronic package module and method for fabrication of the same" was invented by Ming Chang Tsai (Guangdong Province, China) and Ta-Te Hsieh (Guangdong Province, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package module and a method for fabrication of the same are provided. The electronic package module has the circuit substrate with the flat surface and the electronic component located on the circuit substrate. The electronic component includes the input end located on the flat surface of the circuit substrate ...