ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,600, issued on Aug. 4, was assigned to UPL Ltd. (Mumbai, India).
"Polymeric material composition" was invented by Rajan Ramakant Shirsat (Mumbai, India) and Pradip Dattatray Wagh (Mumbai, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a polymeric material composition comprising: (a) at least one superabsorbent polymer; and (b) 0.1% w/w to 2% w/w microporous silicon dioxide; wherein polymeric material composition exhibits non-hygroscopic characteristics with moisture content less than 15% w/w of the total weight of the polymeric material composition at room temperature. The present invention further provides proces...