US Patent Issued to University Of Science And Technology Of China on March 17 for "Isolated power chip based on wafer level packaging and method of manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,945, issued on March 17, was assigned to University Of Science And Technology Of China (Hefei, China).

"Isolated power chip based on wafer level packaging and method of manufacturing the same" was invented by Lin Cheng (Hefei, China) and Dongfang Pan (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An isolated power chip based on wafer level packaging, including: an RDL-based micro-transformer, where a primary coil of the RDL-based micro-transformer is connected to a direct-current power supply and configured to output a direct-current voltage input by the direct-current power supply; a transmitting chip connected to the primary coil of...