US Patent Issued to United Semiconductor (Xiamen) on Sept. 8 for "Method for detecting back surface of wafer" (Singaporean, Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,454, issued on Sept. 8, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Xiamen, China).

"Method for detecting back surface of wafer" was invented by Chen Feng Wang (Shamen City, China), Ching-Shu Lo (Singapore), Tsung Che Lin (Singapore), Sen-Chih Chang (Tainan City, Taiwan) and Wen Yi Tan (Xiamen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a method for detecting the back surface of a wafer, which comprises providing a wafer and performing a detection step on the back surface of the wafer, wherein the detection step comprises capturing a gray scale map of the back surface of the wafer, finding out at least on...