ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,555, issued on Feb. 24, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Fujian, China).
"Method for aligning to a pattern on a wafer" was invented by Dian Han Liu (Shamen, China), Maohua Ren (Shamen, China), Yuan-Chi Pai (Fujian, China) and Wen Yi Tan (Fujian, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixel...