US Patent Issued to UNITED MICROELECTRONICS on Sept. 8 for "Method of forming semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,406, issued on Sept. 8, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Method of forming semiconductor device" was invented by Kuo-Hsing Lee (Hsinchu County, Taiwan), Chun-Hsien Lin (Tainan City, Taiwan) and Sheng-Yuan Hsueh (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a semiconductor device and a method of forming the same, and the semiconductor device includes a substrate, a first interconnect layer and a second interconnect layer. The first interconnect layer is disposed on the substrate, and the first interconnect layer includes a first dielectric layer around a plura...