US Patent Issued to UNITED MICROELECTRONICS on Sept. 1 for "Semiconductor structure and method for manufacturing the same" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,447, issued on Sept. 1, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing the same" was invented by Tien-Tsai Hung (Singapore), Yi Liu (Singapore), Guo-Hai Zhang (Singapore) and Ching-Hwa Tey (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a wafer structure. The wafer structure has a normal region and a trimmed region adjacent to the normal region. A top surface of the trimmed region is lower than a top surface of the normal region. The semiconductor structure includes a dielectric layer and a con...