US Patent Issued to UNITED MICROELECTRONICS on Oct. 6 for "Semiconductor structure and alignment method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,744, issued on Oct. 6, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor structure and alignment method thereof" was invented by Chiao-Yi Teng (Taichung City, Taiwan) and Kun-Ju Li (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a semiconductor structure, which comprises a first chip and a second chip attached to each other, wherein the first chip comprises a quantum dot pattern, and the second chip comprises a through silicon via (TSV), wherein the quantum dot pattern and the through silicon via are aligned with each other."

The patent was filed on Nov. 28, 2023, under A...