US Patent Issued to UNITED MICROELECTRONICS on Oct. 6 for "Barrier layers for interconnects in bonded wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,721, issued on Oct. 6, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Barrier layers for interconnects in bonded wafers" was invented by Yu-Chun Chen (Kaohsiung City, Taiwan), Yu-Ping Wang (Hsinchu City, Taiwan), I-Ming Tseng (Kaohsiung City, Taiwan), Yi-An Shih (Changhua County, Taiwan), Chung-Sung Chiang (Kaohsiung City, Taiwan) and Chiu-Jung Chiu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes the steps of first bonding a top wafer to a bottom wafer, in which the top wafer has a first metal interconnection including a first barrier layer exposing ...