US Patent Issued to UNITED MICROELECTRONICS on May 12 for "Semiconductor package, semiconductor bonding structure, and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,692, issued on May 12, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor package, semiconductor bonding structure, and method of fabricating the same" was invented by Kai-Kuang Ho (Hsinchu City, Taiwan), Yu-Jie Lin (Taichung City, Taiwan) and Yi-Feng Hsu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor package, a semiconductor bonding structure and a method of fabricating the same. The semiconductor package includes a first chip, a second chip and a conductive structure, wherein the conductive structure is disposed at a side of the second chip an...