ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,493, issued on March 31, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).
"Semiconductor structure and manufacturing method thereof" was invented by Ching-Ling Lin (Kaohsiung City, Taiwan), Wen-An Liang (Tainan City, Taiwan), Chia-Fu Hsu (Tainan City, Taiwan) and Huang-Ren Wei (Tainan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a semiconductor structure, the semiconductor structure comprises a substrate, a dielectric layer located on the substrate, a plurality of gate structures located in the dielectric layer on the substrate, a plurality of first metal layers located on a part of the ga...