US Patent Issued to United Microelectronics on March 31 for "Manufacturing method of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,636, issued on March 31, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor structure" was invented by Kun-Ju Li (Tainan, Taiwan), Hsin-Jung Liu (Pingtung County, Taiwan), Jhih Yuan Chen (Kaohsiung, Taiwan), I-Ming Lai (Kaohsiung, Taiwan), Ang Chan (Taipei, Taiwan), Wei Xin Gao (Tainan, Taiwan), Hsiang Chi Chien (Pingtung County, Taiwan), Hao-Che Hsu (Tainan, Taiwan), Chau Chung Hou (Tainan, Taiwan) and Zong Sian Wu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first w...