US Patent Issued to UNITED MICROELECTRONICS on March 3 for "Module for predicting semiconductor physical defects and method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,420, issued on March 3, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Module for predicting semiconductor physical defects and method thereof" was invented by Pin-Yen Tsai (Hsinchu City, Taiwan), Man-Ting Pang (Hsinchu City, Taiwan) and Yi-Jung Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module for predicting semiconductor physical defects includes a defect diagnosis unit used to detect at least one failure circuit in a semiconductor circuit structure; an information acquisition unit used for obtaining a semiconductor mask layout for forming the semiconductor circuit structure, and obtaining a fai...