ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,488, issued on June 2, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).
"Semiconductor device" was invented by Yu-Chun Chen (Kaohsiung City, Taiwan), Yu-Ping Wang (Hsinchu City, Taiwan), I-Ming Tseng (Kaohsiung City, Taiwan), Yi-An Shih (Changhua County, Taiwan), Chung-Sung Chiang (Kaohsiung City, Taiwan) and Chiu-Jung Chiu (Tainan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a bottom wafer, a top wafer bonded to the bottom wafer, a first dielectric layer, a second dielectric layer, a deep via conductor structure, and a connection pad. The top wafer includes a first interconnection ...