US Patent Issued to UNITED MICROELECTRONICS on July 28 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,499, issued on July 28, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Hsin-Yu Chen (Nantou County, Taiwan), Chun-Hao Lin (Kaohsiung City, Taiwan), Yuan-Ting Chuang (Yilan County, Taiwan) and Shou-Wei Hsieh (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, an isolation structure, and a first electrically conductive structure. The semiconductor substrate has a planar device region and a fin device region. The semiconductor substrate includes a mesa structure disposed in the plana...