US Patent Issued to UNITED MICROELECTRONICS on July 14 for "Semiconductor circuit pattern and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,117, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor circuit pattern and manufacturing method thereof" was invented by Yu-Chien Chung (Yunlin County, Taiwan), Yu-Chin Huang (Tainan City, Taiwan), Chao-You Hung (Tainan City, Taiwan) and Wei-Lin Liu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a method for manufacturing semiconductor circuit patterns, which comprises providing a dielectric layer, a mask layer and a first photoresist layer stacked on each other, wherein the first photoresist layer includes a weak pattern, and the weak pattern correspo...