US Patent Issued to UNITED MICROELECTRONICS on Feb. 17 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,327, issued on Feb. 17, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Semiconductor device and method for fabricating the same" was invented by Chen-Wei Pan (Hsinchu County, Taiwan) and Sheng Cho (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate; a fin structure disposed over the substrate; a gate structure disposed over the substrate, wherein an extension direction of the fin structure intersects an extension direction of the gate structure; and a first well disposed under the gate structure, corresponding to an emitter region of the semiconductor device, and having a ...