US Patent Issued to UNITED MICROELECTRONICS on Feb. 17 for "Method for defining valid die positions on inspection wafer map" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,265, issued on Feb. 17, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Method for defining valid die positions on inspection wafer map" was invented by Hsiang-Yuan Hu (Tainan, Taiwan), Tzu-Chung Yang (Tainan, Taiwan), Chien-Ting Li (Tainan, Taiwan) and Ming-Hsiu Lo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for defining valid die positions on an inspection wafer map includes the following steps. A position of a reference die in an inspection wafer map is obtained, and the position of the reference die is adjacent to a center point of the inspection wafer map. A map center data is obtained, and the coo...