US Patent Issued to UNITED MICROELECTRONICS on April 7 for "Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,998, issued on April 7, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof" was invented by Da-Jun Lin (Kaohsiung City, Taiwan), Bin-Siang Tsai (Changhua County, Taiwan), Fu-Yu Tsai (Tainan City, Taiwan) and Chung-Yi Chiu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer includes a substrate having an inductor forming region thereon, a plurality of trenches within the inductor forming region in the substrate, a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the p...