US Patent Issued to Unimicron Technology on Sept. 1 for "Chip package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,517, issued on Sept. 1, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan).

"Chip package structure and manufacturing method thereof" was invented by John Hon-Shing Lau (Taoyuan City, Taiwan) and Tzyy-Jang Tseng (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure includes a first chip, a second chip, a plurality of first hybrid bonding pads, a first insulating layer, a first patterned conductive layer, a second patterned conductive layer, and a plurality of first conductive via structures and second conductive via structures. The first chip is electrically connected to the second chip through ...