US Patent Issued to UNIMICRON TECHNOLOGY on March 3 for "Anti-diffusion substrate structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,810, issued on March 3, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan City, Taiwan).

"Anti-diffusion substrate structure and manufacturing method thereof" was invented by Yi Ling Chen (Taoyuan City, Taiwan), Wei Tse Ho (Taoyuan City, Taiwan), Chin-Sheng Wang (Taoyuan City, Taiwan), Pu-Ju Lin (Taoyuan City, Taiwan) and Cheng-Ta Ko (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first...