ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,135, issued on March 24, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).
"Method of manufacturing circuit board" was invented by Chin-Sheng Wang (Hsinchu City, Taiwan) and Pei-Chang Huang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second...