US Patent Issued to Unimicron Technology on June 23 for "Circuit board with embedded chip and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,992, issued on June 23, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Circuit board with embedded chip and method of manufacturing the same" was invented by Yu-Shen Chen (Taoyuan, Taiwan) and I-Ta Tsai (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a circuit board with an embedded chip, which includes a dielectric layer, a first circuit layer, a chip, a conductive connector, and an insulating protection layer. The first circuit layer includes at least one first trace in the dielectric layer. The chip is in the dielectric layer and adjacent to the first trace, where the chip includes a...