US Patent Issued to UNIMICRON TECHNOLOGY on July 21 for "Wiring board structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,141, issued on July 21, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan City, Taiwan).

"Wiring board structure" was invented by Wen-Hsien Lu (Taoyuan City, Taiwan) and Yu-Ling Chuang (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board structure is provided, which includes a substrate, a first build-up circuit layer, and a second build-up circuit layer. The first build-up circuit layer is disposed on a first side of the substrate and has a first wiring area, and the first wiring area includes a first metal and a first dielectric. The second build-up circuit layer is disposed on a second side of the substrate and ha...