ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,667, issued on Feb. 24, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).
"Manufacturing method of circuit board structure" was invented by Tzyy-Jang Tseng (Taoyuan City, Taiwan), Cheng-Ta Ko (Taipei City, Taiwan), Pu-Ju Lin (Hsinchu City, Taiwan), Chi-Hai Kuo (Taoyuan City, Taiwan), Shao-Chien Lee (Taoyuan City, Taiwan), Ming-Ru Chen (Hsinchu City, Taiwan) and Cheng-Chung Lo (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a circuit board structure includes the following steps. A first sub-circuit board having an upper surface and a lower surface opposite to each other and including at lea...