US Patent Issued to Ulrich Rotte Anlagenbau und Foerdertechnik on Oct. 27 for "Device for producing multi-layer circuit boards and use thereof in a multi-level heat press" (German Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,591, issued on Oct. 27, was assigned to Ulrich Rotte Anlagenbau und Foerdertechnik GmbH (Salzkotten, Germany).

"Device for producing multi-layer circuit boards and use thereof in a multi-level heat press" was invented by Ulrich Rotte (Salzkotten, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device for producing multi-layer circuit boards, comprising a multi-part tool having a tool lower part and a tool upper part. In the intended use of the tool, multiple functional layers and at least one insulating layer of a multi-layer circuit board to be produced are arranged between the tool lower part and the tool upper part. At least one measurin...