US Patent Issued to TSUDAKOMA KOGYO on Nov. 3 for "Automated fiber bundle placement apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,779,793, issued on Nov. 3, was assigned to TSUDAKOMA KOGYO K.K. (Ishikawa-ken, Japan).

"Automated fiber bundle placement apparatus" was invented by Isao Nishimura (Ishikawa-ken, Japan) and Yasuyuki Ishida (Ishikawa-ken, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An automated fiber bundle placement apparatus is configured to lay a strip-like fiber bundle impregnated with a thermoplastic resin on a stacking surface on an upper side of a placement die by moving a placement head and by emitting a laser from an emitting device to deposit the fiber bundle on the stacking surface incompletely. The emitting device is configured to emit the laser toward...