US Patent Issued to TSMC CHINA, TAIWAN SEMICONDUCTOR MANUFACTURING on June 2 for "Method and apparatus for removing expansion bolt for semiconductor processing apparatus" (Chinese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,183, issued on June 2, was assigned to TSMC CHINA COMPANY Ltd. (Shanghai) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and apparatus for removing expansion bolt for semiconductor processing apparatus" was invented by Xudong Liu (Shanghai), Chi Sun (Shanghai), Guangren Shi (Shanghai) and Jinsong Zeng (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes following steps. A washer and a nut are removed from a threaded rod of an expansion bolt that is secured to a drilled hole. After removing the washer and the nut, foot of a semiconductor processing apparatus is removed from the threaded rod. The wa...