ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,646, issued on April 14, was assigned to TSINGHUA UNIVERSITY (Beijing).
"Simulated eggshell perforation test device" was invented by Ying Liu (Beijing) and Mingyan Zhao (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a simulated eggshell perforation test device, which includes a simulated eggshell and a perforation device for perforating at a preset perforation position of the simulated eggshell. The simulated eggshell is an eggshell that is enlarged multiple times in proportion to an egg, thereby solving the problem that due to small size of the egg, the stress detector cannot be attached to a surface of th...