ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,971, issued on May 12, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas) and Toyota Jidosha K.K. (Toyota, Japan).

"Cooling manifold assemblies, charging modules, and charging systems" was invented by Yanghe Liu (Ann Arbor, Mich.), Feng Zhou (Ann Arbor, Mich.) and Hiroshi Ukegawa (South Lyon, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coolant manifold assembly is provided. The coolant manifold assembly may include a manifold body having a coolant delivering channel delivering coolant to a charging module fluidly communicating with the coolant delivering channel, and a coolant receiving channel recei...