US Patent Issued to TOYOTA JIDOSHA on Oct. 27 for "Heat management system including thermal expansion material configured to shrink or expand depending on temperature" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,686, issued on Oct. 27, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan).

"Heat management system including thermal expansion material configured to shrink or expand depending on temperature" was invented by Hiroshi Yamamoto (Toyota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The heat management system includes a power semiconductor (heat generation portion). The power semiconductor has a heat dissipation path. The heat dissipation path is configured to transfer heat from the power semiconductor to other portions than the power semiconductor. As the temperature of the power semiconductor increases, the amount of heat dissipation of the ...