US Patent Issued to TOWA on Sept. 22 for "Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,402, issued on Sept. 22, was assigned to TOWA Corp. (Kyoto, Japan).

"Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatus" was invented by Tomoyuki Goto (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a resin molded product which does not use a spreading member for spreading a resin and achieves applying a liquid resin in a short time even when an area to be applied with the liquid resin is large. The method includes: applying liquid resin (21) on film (11), and performing resin molding with liquid resin (21) applied in the applying the liquid...