US Patent Issued to TOSOH SMD on Oct. 20 for "High purity sulfur-doped copper sputtering target assembly and method for producing same" (Ohio Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,846, issued on Oct. 20, was assigned to TOSOH SMD INC. (Grove City, Ohio).

"High purity sulfur-doped copper sputtering target assembly and method for producing same" was invented by Eduardo Del Rio Perez (Dublin, Ohio) and Harrison Collin Whitt (Grove City, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are copper and copper alloy sputtering targets and sputtering target assemblies, including copper-sulfur sputtering targets, and systems and methods thereof. The copper and copper alloy sputtering targets, including copper-sulfur sputtering targets may have one or more (or all) of the following properties: high purity, uniform compositi...