US Patent Issued to Topsoe on Oct. 6 for "SOC stack comprising integrated interconnect and spacer" (Danish, Estonian Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,998, issued on Oct. 6, was assigned to Topsoe A/S (Kgs. Lyngby, Denmark).

"SOC stack comprising integrated interconnect and spacer" was invented by Thomas Heiredal-Clausen (Birkerod, Denmark), Jeppe Rass-Hansen (Copenhagen, Denmark), Tobias Holt Norby (Glostrup, Denmark), Bengt Peter Gustav Blennow (Humlebaek, Denmark), Rainer Kungas (Peetri, Estonia) and Martin Refslund Nielsen (Birkerod, Denmark).

According to the abstract* released by the U.S. Patent & Trademark Office: "A Solid Oxide Cell stack has an integrated interconnect and spacer, which is formed by bending a surplus part of the plate interconnect 180deg to form a spacer part on top of the interconnect and connected to t...