US Patent Issued to TOPPAN on Sept. 15 for "Biodegradable resin composition and molded body" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,555, issued on Sept. 15, was assigned to TOPPAN INC. (Tokyo).

"Biodegradable resin composition and molded body" was invented by Asuka Kimura (Tokyo), Hideaki Iwamoto (Tokyo) and Seiji Furuya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a biodegradable resin composition having a high degradation rate. The biodegradable resin composition is a biodegradable resin composition having water holding properties. The biodegradable resin composition preferably contains a biodegradable resin and is preferably capable of holding 0.007 g or more and 15.0 g or less of water relative to 1 g of the biodegradable resin. The biodegradable resin ...