US Patent Issued to TOPPAN HOLDINGS on Oct. 20 for "Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,379, issued on Oct. 20, was assigned to TOPPAN HOLDINGS INC. (Tokyo).

"Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method" was invented by Yuki Umemura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A glass substrate includes a through hole that penetrates the glass substrate from a first surface to a second surface. The through hole has a minimum bore diameter in the through hole in a section of 1% to 10% from the first surface in a section from the first surface to the second surface."

The patent was filed on Sept. 4, 2024, under Application No. 18/824,153.

*For further information, i...