US Patent Issued to TOPPAN HOLDINGS on July 28 for "Wiring board and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,385, issued on July 28, was assigned to TOPPAN HOLDINGS INC. (Tokyo).

"Wiring board and manufacturing method therefor" was invented by Tomoyuki Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second condu...