US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 29 for "Composite ceramic substrate having multi-layer configuration" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,191, issued on Sept. 29, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Composite ceramic substrate having multi-layer configuration" was invented by Kai-Mou Chou (Taipei City, Taiwan), Shih-Han Wu (Taipei City, Taiwan), Jhih-Wei Lai (Taipei City, Taiwan) and Jian-Yu Shih (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite ceramic substrate having multi-layer configuration includes a nitride ceramic core layer, two composite layers respectively formed on two opposite sides of the nitride ceramic core layer, and two ceramic covering layers that are respectively formed on the two composite la...