US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Method for reducing warpage occurred to substrate during packaging process" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,505, issued on Sept. 1, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Method for reducing warpage occurred to substrate during packaging process" was invented by Yu-Hsiang Liu (Taipei City, Taiwan) and Li-Chun Hung (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for reducing warpage occurred to a substrate during a packaging process includes attaching a plurality of dies to an upper surface of the substrate; attaching an adhesive material having a first curing temperature to a lower surface of the substrate; applying a liquid-packaging material having a second curing temperature to surroun...