US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Active metal brazing substrate and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,722,359, issued on Sept. 1, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Active metal brazing substrate and method for manufacturing the same" was invented by Chih-Wei Mao (Taipei City, Taiwan), Tsung-Ying Chang (Taipei City, Taiwan), Chung-Ho Wei (Taipei City, Taiwan), Ming-Yi Hsu (Taipei City, Taiwan) and Chi-Wen Huang (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An active metal brazing substrate and a method for manufacturing the same are provided. The active metal brazing substrate includes a ceramic substrate layer, an active metal layer, and a conductive metal layer. The active metal layer is...