ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,854, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taoyuan City, Taiwan).
"Power chip package structure" was invented by Zzu-Chi Chiu (Taipei City, Taiwan), Yu-Te Hsieh (Taipei City, Taiwan), Yan-Wei Chen (Taipei City, Taiwan), Chih-Yu Chung (Taipei City, Taiwan) and Yu-Ju Kuo (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power chip package structure includes a power chip, a first transmission member, two second transmission members, an encapsulant, and an insulating inorganic member. The first and second transmission members are connected to the power chip. The power chip, the first and second trans...